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Senior Process Engineer

Company Name:
TEL NEXX, Inc.
Department Summary:
The Advanced Technology Department is responsible for new product and technology platform design, development, and commercialization, which includes latest electro-deposition and photoresist stripping systems, and individual process that will be applied to fabrication in the near future.
Job Duties:
-Provide technical support of bump electroplating process in wafer lever packaging fabrication.
-Resolve and improve manufacturing issues associated with process, equipment and parameters in electroplating process.
-Perform root cause analysis and yield improvement by working with R&D and production engineering groups from customers.
-Collaborate with chemistry suppliers to search and apply new material and chemical specifications with feasibility test.
-Work with academic researchers on the fundamental study of plating chemistry.
-Drive, execute, and analyze experiments to meet engineering specifications for new or modified electroplating process in the fabrication.
-Participate in development of tool design and intellectual property.
Minimum Requirements:
A PhD degree or foreign equivalent in Chemical Engineering, Material Science, or related discipline and 3 years of industry experience in electrochemistry. Experience may be gained before or after Ph.D. Experience must include the following, which may be gained concurrently:
-3 years experience with electroplating;
-3 years experience in silicon via (TSV) technology;
-3 years experience in wafer level packaging fabrication (to include bumping and flip chip processes);
-3 years experience maintaining process and electro-deposition equipment;
-3 years experience leading cross-departmental teams through technical issues and integration projects.
Job site: 900 Middlesex Turnpike, Billerica, MA 01821. Full-time.
JOB OPPORTUNITY QUALIFIES FOR EMPLOYEE INCENTIVE REFERRAL PROGRAM.
To learn more & to apply online, visit our website at: www.tel.com & reference Req. # 4845.

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